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Specifications of Bis-(sodium sulfopropyl)-disulfide丨CAS 27206-35-5
|
Properties |
White or light yellow powder |
|
Purity (245nm) |
98.0% min |
|
Moisture |
1.50% max |
|
pH (38%) |
2.0 to 6.0 |
|
Water soluble (38%) |
Colorless transparent liquid |
Overview
Bis-(sodium sulfopropyl)-disulfide丨CAS 27206-35-5, often abbreviated as SPS, is an important organic sulfur compound widely used as a brightener and accelerator in the electroplating industry, particularly in copper plating baths. It belongs to the class of disulfide compounds with sulfopropyl functional groups, which help improve metal deposition quality.
Applications
1. Electroplating Industry
Copper Electroplating:
SPS is primarily used as a brightening agent in copper plating processes, especially in printed circuit board (PCB) manufacturing.
Accelerator:
It accelerates the copper deposition rate, enabling better control over plating thickness and uniformity.
Improves Surface Finish:
Produces smooth, bright, and fine-grained copper deposits with excellent adhesion and ductility.
2. Electronics Manufacturing
Key additive in semiconductor and electronics industries to ensure high-quality copper layers on PCBs and other components.
3. Other Metal Plating
Occasionally used in plating of other metals where controlled and bright metal layers are required.
Benefits
✅ Enhanced Plating Performance
Provides uniform and bright copper deposits.
Improves the throwing power and reduces defects like pitting.
✅ Process Efficiency
Accelerates plating speed, reducing cycle times and increasing throughput.
✅ Improved Product Quality
Results in highly conductive, corrosion-resistant copper layers crucial for electronic applications.
✅ Compatibility
Works well with other additives such as polyethylene glycol (PEG) and chloride ions in plating baths to achieve optimal results.
Summary
Bis-(sodium sulfopropyl)-disulfide丨CAS 27206-35-5 is a vital additive in copper electroplating, acting as a brightener and accelerator to produce smooth, bright, and uniform copper coatings. Its use enhances plating efficiency and final product quality, especially in high-precision electronics manufacturing.
