Benzocyclobutene丨CAS 694-87-1

Benzocyclobutene丨CAS 694-87-1
Product Introduction:
Catalog No.: SS129944
CAS No.: 694-87-1
Content: 98% min
Product Name: Benzocyclobutene
Molecular Formula: C8H8
Molecular Weight: 104.15
Synonym(s): Bicyclo[4.2.0]octa-1,3,5-triene
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Technical Parameters
Description

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Specifications

 

Appearance Colorless to pale yellow liquid
Identification (NMR) Conforms to structure
Benzocyclobutene 98% min
Styrene 0.5% max
o-Methylbenzyl chloride 0.5% max
o-Xylene 0.5% max
Water 0.3% max
Other 0.5% max

 

 

 

Applications

 

1. Microelectronics and Semiconductor Industry

Benzocyclobutene is a key monomer in advanced microelectronic materials:

Used in the fabrication of dielectric layers in ICs and MEMS (Micro-Electro-Mechanical Systems)

Offers low dielectric constant (low-k), which helps reduce signal delay and power loss in high-speed circuits

Excellent thermal stability and chemical resistance make it suitable for harsh fabrication processes

2. Polymer and Resin Manufacturing

BCB-functionalized polymers are used in photoresists, adhesives, and coatings

Common in high-performance thermosetting polymers for aerospace and electronics

The BCB group allows for thermally induced crosslinking, producing materials with excellent mechanical strength and moisture resistance

3. Materials Science Research

Extensively used in photo-patternable polymers, photonic devices, and nanostructures

Allows development of stable, low-stress films for wafer bonding, 3D integration, and optical applications

4. Synthetic Organic Chemistry

Acts as a building block for constructing polycyclic aromatic compounds

The strained ring system undergoes ring-opening reactions, which can be leveraged for targeted molecular synthesis

 

Benefits

 

 

✅ Thermally Reactive

BCB undergoes thermal ring-opening polymerization at ~200–250 °C, forming highly crosslinked structures without releasing byproducts

✅ Low Dielectric Constant

Ideal for on-chip interlayer dielectrics, enabling faster signal transmission and lower power consumption

✅ Excellent Thermal and Chemical Stability

Withstands high processing temperatures and chemical etchants, making it suitable for integrated circuit manufacturing

✅ Good Adhesion and Planarity

Forms uniform, smooth films with excellent adhesion to various substrates like silicon, glass, and metals

✅ Moisture and Oxidation Resistance

Finished materials are hydrophobic, resisting environmental degradation

 

Conclusion

 

Benzocyclobutene (CAS 694-87-1) is a strategically important compound in the semiconductor, polymer, and materials industries. With its unique ring structure and thermally reactive properties, BCB enables the fabrication of low-k dielectric layers, high-performance coatings, and photo-patternable materials. Its ability to improve electrical performance, mechanical integrity, and miniaturization of electronic devices makes it a critical enabler in next-generation microfabrication technologies.

 

 

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