9,9'-Spirobi(9H-fluorene)-2-boronic Acid丨CAS 236389-21-2

9,9'-Spirobi(9H-fluorene)-2-boronic Acid丨CAS 236389-21-2
Product Introduction:
CAS No.: 236389-21-2
Product Name: 9,9'-Spirobi(9H-fluorene)-2-boronic Acid
Molecular Formula: C25H17BO2
Molecular Weight: 360.2
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Technical Parameters
Description

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9,9'-Spirobi(9H-fluorene)-2-boronic acid (CAS 236389-21-2), also known as spirobifluorene-2-boronic acid, is an aromatic organoboron compound featuring two fluorene units connected through a central spiro carbon atom and a boronic acid group at the 2-position. Its rigid, three-dimensional molecular framework distinguishes it from conventional planar aromatic compounds. The spirobifluorene structure is widely investigated in organic electronic materials because it can provide high molecular rigidity, reduce excessive intermolecular π-stacking, and support favorable thermal and morphological characteristics in suitably designed derivatives. The boronic acid functionality enables further structural modification, making this compound a valuable intermediate for OLED materials development, organic semiconductor research, and specialty organic synthesis.

 

 

Chemical Identifiers

 

InChI 1S/C25H17BO2/c27-26(28)16-13-14-20-19-9-3-6-12-23(19)25(24(20)15-16)21-10-4-1-7-17(21)18-8-2-5-11-22(18)25/h1-15,27-28H
InChI Key WDDLHUWVLROJLA-UHFFFAOYSA-N
Smiles OB(C1=CC(C2(C3=C(C4=C2C=CC=C4)C=CC=C3)C5=C6C=CC=C5)=C6C=C1)O
EC No. 678-491-1
MDL No. MFCD13248568
PubChem CID 22564369

 

 

 

Applications

 

Applications in Suzuki–Miyaura Cross-Coupling Reactions

The boronic acid group enables 9,9'-Spirobi(9H-fluorene)-2-boronic acid to participate in Suzuki–Miyaura cross-coupling reactions. Under optimized palladium-catalyzed conditions, it can react with suitable aryl or heteroaryl halides to form new carbon–carbon bonds. This provides an efficient route for incorporating the spirobifluorene fragment into larger aromatic structures. The transformation is particularly useful for synthesizing advanced OLED intermediates, functionalized polyaryl compounds, and specialty organic electronic materials.

Applications in OLED Materials Development

9,9'-Spirobi(9H-fluorene)-2-boronic acid is particularly relevant to the synthesis of organic light-emitting diode (OLED) materials. Spirobifluorene derivatives are investigated as structural components in host materials, charge-transport materials, and other functional OLED layers. Their rigid, nonplanar frameworks can help limit molecular aggregation and support morphological stability. Through suitable coupling reactions, this compound can be connected with carbazole, triarylamine, or other aromatic units to prepare candidate materials with tailored electronic characteristics. The resulting derivatives may be evaluated for charge transport, thermal stability, energy-level alignment, and device performance.

 

Applications in OLED Host Material Research

The spirobifluorene framework provides a useful structural platform for developing OLED host material candidates. Its three-dimensional geometry can influence intermolecular interactions and the organization of molecules in thin films. The boronic acid group allows researchers to introduce additional aromatic or heteroaromatic fragments that modify electronic and excited-state properties. Resulting compounds may be investigated for host–dopant compatibility, charge balance, thermal behavior, and operational stability. Their suitability for specific OLED technologies depends on experimentally measured properties.

 

Applications in Hole-Transport Materials Research

9,9'-Spirobi(9H-fluorene)-2-boronic acid can serve as a precursor for preparing organic hole-transport material candidates. By coupling the spirobifluorene framework with electron-donating groups, such as appropriately selected arylamine or carbazole units, researchers can develop molecules intended to support hole transport. The rigid spiro structure may contribute to favorable film morphology and thermal characteristics. These derivatives can be evaluated for hole mobility, ionization energy, film-forming behavior, and compatibility with adjacent device layers.

 

 

 

 

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